Master High-Speed Board Design: Build Your Own System on Module

What you will learn:

Extract Selection information from Requirement Sheets for various components (Processor, SDRAM, EMMC, WIFI/BT modules)
Choose a Processor based on Core Count, Cache, Bandwidth, and Clock Requirements
Understand Processor Architectures like Little-big and Memory Organization
Explore Different Types of SDRAMs (DDRX, LPDDRX, and Enhanced Versions)
Compare External SDRAMs up to DDR5 and LPDDR5
Learn Signal Groups of SDRAM (Data, Address, Command, Control, Clock)
Develop a Systematic Approach to Selecting Components (SDRAM, PMIC, EMMC, WIFI Module, Processor) for Mobile Applications
Analyze Datasheets of components (RK3399, LPDDR4 SDRAM, EMMC, PMIC, WIFI/BT Module)
Map Pins of SDRAM, EMMC, SDIOs, MIPIs, EDPs, Type-C, USB3.0/2.0, SDMMC with RK3399 on an Excel Sheet
Design Schematics for Processor, SDRAM, EMMC, WIFI, and PMIC using Datasheets and Design Guidelines
Explore WIFI/BT Module Certification and Regulations (US, Europe, Canada)
Plan Impedance Profiles for over 1000 interconnects using Excel
Execute Layer Stack Up (4/6/8/12L), Component Placement Planning, and Execution
Implement Layout Planning, Preliminary Layout, High-Speed Design Rules, Length Matching, Power Plane Design, and Optimization
Master FAN-OUT for RK3399 (828 Balls), LPDDR4 SDRAM (200 Balls), and EMMC (180 Balls)

Description

Dive deep into the world of high-speed board design with this comprehensive course. You'll gain hands-on experience designing a System on Module (SOM) using the RK3399 processor, LPDDR4 SDRAM, WIFI/BT module, EMMC, PMIC, and a 260-pin DDR4 system.

This course is divided into 13 distinct sections, each packed with multiple in-depth lessons covering key aspects of hardware design:

Requirements Analysis: Define your project's needs and analyze the RK3399 processor datasheet in detail.
SDRAM Selection and Design: Master the process of selecting the right SDRAM (SDR/DDRX/LPDDRX) for your application, understand pin mapping, and create schematic designs from the datasheet.
PMIC Design: Choose and design the perfect PMIC (Power Management IC) for your SOM, ensuring efficient power management for all components.
EMMC Design: Select the right EMMC (Embedded Multimedia Card) chip for your project, understand its pin mapping, and design the schematic.
WIFI/BT Module Selection: Explore different WIFI/BT modules, understand certifications (US/EU/CA), and design the schematic.
External LDO/DC-DC/Buck-Boost Design: Learn how to select and design external power components like LDOs, DC-DCs, and Buck-Boost converters.
RK3399 Schematic Design: Create a detailed schematic design of the RK3399 processor, including pin mapping and impedance planning.
Layer Stack Up and Placement Planning: Master the layer stack up process (4/6/8/12L), plan component placement efficiently, and execute the placement in Part 1.
Component Placement Execution (Parts 2 & 3): Continue your component placement journey, ensuring optimal design.
Layout Planning and Optimization: Dive into layout planning, high-speed design rules, length matching, power plane design by sections, and layout optimization in Part 1.
Power Plane Design and Optimization: Complete your power plane design and layout optimization.

This course will equip you with the skills to:

Design your own processor boards without relying on simulation models or third-party support.
Create pre-schematic design blocks like block diagrams and power budgets.
Master different grounding techniques (signal, earth, chassis).
Understand power distribution network analysis (PDN analysis).
Learn the use of ferrite beads, ESD diodes, and magnetic components.
Plan and layout designs using tools like Microsoft Paint.